Heat pump device
AssigneeDaikin Industries, Ltd.
InventorsYukio MATSUSAKA, Teruo NISHIDA, Kento OKUZAWA
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AssigneeDaikin Industries, Ltd.
InventorsYukio MATSUSAKA, Teruo NISHIDA, Kento OKUZAWA
Estimating the term…
A heat pump device comprises a refrigerant circuit in which a compressor, a first indoor heat exchanger, an electric expansion valve, and a heat source-side heat exchanger are connected in a loop, a second indoor heat exchanger arranged between the compressor and the electric expansion valve and configured to store refrigerant during positive cycle defrost operation, an electromagnetic valve arranged between the second indoor heat exchanger and the electric expansion valve and configured to adjust an amount of refrigerant stored in the second indoor heat exchanger during the positive cycle defrost operation, and a control device that controls the compressor and the electric expansion valve.
A heat pump device comprising:
Dependencies are inferred from the claim text.