Plating method and plated metal
AssigneeDae San Electronics Co., Ltd.
InventorsDo Young Cheong, Jin Wook Choi, June Seok Oh, Ri A Kim, Hae Sun Yon
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AssigneeDae San Electronics Co., Ltd.
InventorsDo Young Cheong, Jin Wook Choi, June Seok Oh, Ri A Kim, Hae Sun Yon
Estimating the term…
Provided is a plating method including performing a first masking that masks a first region and a second region among the first region including only a first metal and the second region including only a second metal in a clad metal having the first metal and the second metal cladded, and a third region including a contact part between the first metal and the second metal, precipitating the clad metal in a first plating solution, performing a second masking that removes the processed masking in one of the first region and the second region, precipitating at least the region where the second masking has been performed in a second plating solution, and precipitating the region where the second masking has been performed and the third region in a third plating solution.
A plating method, comprising:
A plated metal, comprising:
Dependencies are inferred from the claim text.