Solid wire and method of manufacturing welded joint
AssigneeNippon Steel Corporation
InventorSuo SARUWATARI
Life of this patent
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Abstract
A solid wire according to an aspect of the present invention contains, as a chemical composition: C: 0.003% to 0.080%; Si: 0.0010% to 0.50%; Mn: 0.050% to 1.80%; Al: 0.030% to 0.500%; Ni: 8.0% to 16.0%; P: 0.0200% or less; S: 0.0100% or less; O: 0.050% or less; Ta: 0% to 0.1000%; Cu: 0% to 0.5%; Cr: 0% to 0.5%; Mo: 0% to 0.5%; V: 0% to 0.20%; Ti: 0% to 0.10%; Nb: 0% to 0.10%; B: 0% to 0.010%; Mg: 0% to 0.80%; REM: 0% to 0.050%; and a remainder: Fe and impurities, a is 1.35% to 5.50%, and Ceq is 0.250% to 0.520%.
Claims9
A solid wire comprising, as a chemical composition, by mass % with respect to a total mass of the solid wire:
- C:
- 0.003% to 0.080%;
- Si:
- 0.0010% to 0.50%;
- Mn:
- 0.050% to 1.80%;
- Al:
- 0.030% to 0.500%;
- Ni:
- 8.0% to 16.0%;
- P:
- 0.0200% or less;
- S:
- 0.0100% or less;
- O:
- 0.050% or less;
- Ta:
- 0% to 0.1000%;
- Cu:
- 0% to 0.5%;
- Cr:
- 0% to 0.5%;
- Mo:
- 0% to 0.5%;
- V:
- 0% to 0.20%;
- Ti:
- 0% to 0.10%;
- Nb:
- 0% to 0.10%;
- B:
- 0% to 0.010%;
- Mg:
- 0% to 0.80%;
- REM:
- 0% to 0.050%;
- and
- a remainder:
- Fe and impurities,
- wherein α defined by Formula a described below is 1.35% to 5.50%, and
- Ceq defined by Formula b described below is 0.250% to 0.520%,
- α=2×[Mn]+[Al]+1.5×[Ti]+[Mg]+10×[Ta] (Formula a)
- Ceq=[C]+[Si]/24+[Mn]/6+[Ni]/40+[Cr]/5+[Mo]/4+[V]/14 (Formula b)
- in Formulae a and b, each element with [ ] indicates an amount of the element by mass % with respect to the total mass of the solid wire.
Dependencies are inferred from the claim text.