Tungsten Chemical Mechanical Planarization (CMP) With Low Dishing And Low Erosion Topography
AssigneeVersum Materials US, LLC
InventorsMatthias Stender, Agnes Derecskei, Bradley J. Brennan
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Abstract
This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
Claims20
A chemical mechanical planarization (CMP) composition comprising:
- an abrasive;
- an oxidizing agent;
- a bicyclic amidine compound or hydrolyzed derivative;
- and
- a solvent;
- wherein the CMP composition has a pH ranging from 2 through 5.
A method for chemical mechanical planarization (CMP) of a tungsten-containing surface of a semiconductor device, comprising steps of:
- a. providing a chemical mechanical planarization (CMP) composition comprising:
- i. an abrasive;
- ii. an oxidizing agent;
- iii. a bicyclic amidine compound or hydrolyzed derivative;
- iv. and
- v. a solvent;
- vi. wherein the CMP composition comprises a pH ranging from 2 through 5;
- b. providing a polishing pad;
- c. applying the CMP composition to the polishing pad;
- d. polishing the tungsten-containing surface with the polishing pad and the CMP composition to produce a polished tungsten-containing surface.
A system for chemical mechanical planarization of a semiconductor substrate having at least one surface comprising tungsten, the system comprising:
- a polishing pad;
- a chemical mechanical planarization (CMP) composition comprising:
- an abrasive;
- an oxidizing agent;
- a bicyclic amidine compound or hydrolyzed derivative;
- and
- a solvent;
- wherein the CMP composition comprises a pH ranging from 2 through 5;
- and an applicator operationally configured to apply the CMP composition to the polishing pad;
- and
- a carrier that is operationally configured to bring the at least one surface comprising tungsten in contact with the polishing pad and the CMP composition.
Dependencies are inferred from the claim text.