Liquid crystal display panel and manufacturing method thereof

A liquid crystal display panel, comprising a first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate, wherein a non-display area of the liquid crystal display panel is provided with a sealing bezel adhesive layer to seal the liquid crystal layer;

• wherein
• the first substrate comprises a first base substrate and a first transparent conductive layer including a first common electrode;
• the second substrate comprises:
• a second base substrate, a first metal layer, a gate insulating layer, a passivation layer, and a second transparent conductive layer disposed on the second base substrate;
• wherein the first metal layer includes a first common voltage signal line, the second transparent conductive layer and the first common voltage signal line are connected by a through-hole;
• the liquid crystal display panel comprises a side bond pad disposed on sides of the first substrate and the second substrate and a side of the sealing bezel adhesive layer away from the liquid crystal layer;
• wherein the side bond pad is in contact with the first transparent conductive layer, and is made by printing a first conductive material on the sides of the first substrate and the second substrate and the side of the sealing bezel adhesive layer away from the liquid crystal layer;
• wherein in the non-display area, a second conductive material is disposed between the first substrate and the second substrate, and the second conductive material is in contact with the first transparent conductive layer and the second transparent conductive layer;
• and
• a side surface of the liquid crystal display panel provided with the side bond pad is bonded with a chip on film, wherein the first transparent conductive layer is electrically connected to a second common voltage signal line on the chip on film through the side bond pad that makes the first common electrode receive a common voltage signal transmitted from the chip on film, and is electrically connected to the second common voltage signal line through the second conductive material, the second transparent conductive layer, and the first common voltage signal line that makes the first common electrode receive the common voltage signal.