Backlight module having a surface light source, liquid crystal display panel and welding method of light-emitting diode chip

A welding method of a light-emitting diode chip, the light-emitting diode chip configured to be used in a backlight module having a surface light source, wherein the method comprises following steps:

• step S10, providing a substrate where a first pad and a second pad disposed spaced apart from each other, a first connected area disposed on the first pad, a second connected area disposed on the second pad, and forming a plurality of pad holes in both the first connected area and the second connected area respectively by an etching process;
• step S20, filling magnetic materials into the plurality of pad holes to form a magnetic film layer;
• step S30, applying a solder paste on both the first connected area and the second connected area;
• step S40, soldering a plurality of pins disposed on two sides of the light-emitting diode chip to the first connected area and the second connected area respectively, wherein the magnetic film layer is configured to absorb the plurality of pins to fix the light-emitting diode chip.