High-throughput optical sectioning three-dimensional imaging system

Abstract

A high-throughput optical sectioning three-dimensional imaging system which includes: a light beam modulation module configured to modulate a light beam into a modulated light beam capable of being focused on a focal plane of an objective lens and being defocused on a defocusing plane of the objective lens; an imaging module configured to employ a camera to image, in different rows of pixels, a sample under illumination of the modulated light beam; a cutting module configured to cut off an imaged surface layer of the sample; a demodulation module configured to demodulate a sample image of one sample strip of one surface layer into an optical sectioning image, and reconstruct the optical sectioning image of each sample strip of each surface layer into a three-dimensional image. The present disclosure achieves imaging of a whole sample by dividing the sample into at least one surface layer, dividing the at least one surface layer into at least one sample strip, and imaging each sample strip. When a multi-layer imaging cannot be performed, the imaged part can be cut off by the cutting module to realize imaging of any layer of the sample, thereby improving the imaging speed and efficiency.

Dependencies are inferred from the claim text.