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US 2021/0333309 A1Published application
Semiconductor probe
OwnerChien Cheng Tieninventor
Life of this patent
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Abstract
A semiconductor probe includes multiple metal layers. An oxide layer is disposed between each adjacent pair of the metal layer. A via for connecting at least one pair of the metal layers. At least one protection layer 150 is disposed at an external side of the metal layer.
Claims5
A semiconductor probe comprising:
- multiple metal layers, wherein an oxide layer is disposed between each adjacent pair of the metal layers;
- and
- a via for connecting at least one pair of the metal layers.
Dependencies are inferred from the claim text.