US 2021/0332280 A1 · THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED

Abstract

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

Claims14

Dependent claims

A composition comprising:

(A) An organopolysiloxane composition;
(B) a filler treating agent;
(C) a thermal stabilizer;
and
(D) thermally conductive filler, comprising:
(D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm;
(D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm;
(D-3) boron nitride having a mean size of from 20 to 200 μm.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/268,143Filed 7 Nov 2018

Published

28 Oct 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification28 codes

C08G 77/12
Polysiloxanes: containing silicon bound to hydrogen
C09K 5/14
Materials not undergoing a change of physical state when used: solid materials, e.g. powdery or granular
C08G 77/18
Containing silicon bound to oxygen-containing groups: to alkoxy or aryloxy groups
C08G 77/20
Polysiloxanes: containing silicon bound to unsaturated aliphatic groups

Thermally conductive composition and methods and devices in which said composition is used

Life of this patent

Thermally conductive composition and methods and devices in which said composition is used

Life of this patent

Abstract

Claims14