Adhesive composition and foamable adhesive sheet
AssigneeDai Nippon Printing Co., Ltd.
InventorsKentaro HOSHI, Shinya SHIMADA
Life of this patent
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Abstract
An adhesive composition including an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent, wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and a weight-average molecular weight of the acrylic resin is 50,000 or more.
Claims16
1-15. (canceled)
An adhesive composition comprising an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent,
- wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and
- a weight-average molecular weight of the acrylic resin is 50,000 or more.
A foaming adhesive sheet comprising at least an adhesive layer,
- wherein the adhesive layer includes an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent,
- as the epoxy resin, the adhesive layer includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and
- a weight-average molecular weight of the acrylic resin is 50,000 or more.
Dependencies are inferred from the claim text.