Bonded structure and method for producing same
AssigneeDenso Corporation
InventorsMasami SAITO, Koji KONDO, Hirotaka MIYANO
Life of this patent
Estimating the term…
Abstract
A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.
Claims13
A bonded structure comprising:
- a first substrate comprising aluminum or an aluminum alloy;
- a first thin film layer formed on a surface of the first substrate;
- and
- a resin adhesive layer bonded to a surface of the first thin film layer,
- wherein the first thin film layer comprises silicate glass comprising a metal element with different valency from Si, as a solid solution,
- the resin adhesive layer comprises a resin comprising a structural site derived from ionic polymerization or a resin capable of dehydration condensation, and
- the first thin film layer and the resin adhesive layer are bonded by ionic bonds or covalent bonds.
A method for producing a bonded structure, the method comprising:
- a preparation step of bringing a first substrate comprising aluminum or an aluminum alloy with an oxide film layer comprising Al2O3 formed at a surface of the first substrate into contact with an alkaline silicate solution to convert the oxide film layer into a first thin film layer (112) of silicate glass that has a metal element with different valency from Si, as a solid solution, thereby preparing the first substrate comprising the aluminum or the aluminum alloy with the first thin film layer formed at the surface of the first substrate;
- a stacking step of obtaining a stacked body wherein the first thin film layer at the first substrate and a resin adhesive material layer formed from a resin adhesive material that is subjected to curing to serve as a resin comprising a structural site derived from ionic polymerization or a resin capable of dehydration condensation are stacked in order;
- and
- a bonding step of heating the stacked body to cause ionic bonds or covalent bonds at an interface between the first thin film layer and the resin adhesive material layer, and further raising the heating temperature to cure the resin adhesive material layer, thereby forming a resin adhesive layer bonded to a surface of the first thin film layer,
- wherein the silicate solution has a silicate concentration of 0.1 mol/L or more and 1.5 mol/L or less.
Dependencies are inferred from the claim text.