Methods and systems for polymer deposition

A system, comprising:

• a deposition chamber comprising a reaction volume;
• and
• a cooling element, wherein:
• the reaction volume is capable of comprising hexafluoropropylene oxide vapor and being evacuated of air by a source of vacuum;
• the reaction volume comprises a filament taking the form of a wire configured to increase in temperature upon the application of a voltage thereto;
• the wire is configured to heat the hexafluoropropylene oxide vapor, thereby causing it to decompose;
• a substrate is positioned in the reaction volume;
• the cooling element is positioned around the substrate;
• and
• the substrate is freely-movable with respect to the cooling element.

A method, comprising:

• polymerizing hexafluoropropylene oxide to form a particle comprising poly(tetrafluoroethylene);
• and
• depositing the particle comprising poly(tetrafluoroethylene) onto a surface, wherein:
• the polymerization is performed in a reaction volume;
• the reaction volume is positioned in a deposition chamber;
• the reaction volume comprises at most 10 mTorr of air and comprises hexafluoropropylene oxide vapor;
• the reaction volume comprises a filament taking the form of a resistively heated wire;
• the wire heats the hexafluoropropylene oxide vapor, thereby causing it to decompose;
• and
• when the particle forms, it is surrounded by gas.

A method, comprising:

• depositing a coating comprising poly(tetrafluoroethylene) on a substrate, wherein:
• the substrate is positioned in a reaction volume;
• the reaction volume is positioned in a deposition chamber;
• the reaction volume comprises at most 10 mTorr of air and comprises hexafluoropropylene oxide vapor;
• the reaction volume comprises a filament taking the form of a resistively heated wire;
• the wire heats the hexafluoropropylene oxide vapor, thereby causing it to decompose;
• the substrate outgasses one or more gases during the deposition of the coating;
• and
• the one or more gases make up greater than or equal to 0.1 mol % and less than or equal to 10 mol % of the gases present in the reaction volume during the deposition of the coating.

A method, comprising:

• removing contaminants from a surface of a substrate by immersing the substrate in a solvent;
• and
• within 30 minutes after the contaminants are removed, depositing a coating comprising poly(tetrafluoroethylene) onto the surface of the substrate by chemical vapor deposition, wherein, during the deposition step:
• the substrate is positioned in a reaction volume;
• the reaction volume is positioned in a deposition chamber;
• the reaction volume comprises at most 10 mTorr of air and comprises hexafluoropropylene oxide vapor;
• the reaction volume comprises a filament taking the form of a resistively heated wire;
• and
• the wire heats the hexafluoropropylene oxide vapor, thereby causing it to decompose;
• and
• wherein, after the deposition step, the coating has an adhesion to the substrate such that its adhesion score, as determined by the procedure described in ASTM D3359, is greater than or equal to 4.