Substrate processing method and substrate processing apparatus

A substrate processing apparatus comprising:

• a substrate holding unit which holds a substrate horizontally;
• a first processing liquid supplying unit which supplies, to an upper surface of the substrate, a first processing liquid which contains a solute and a solvent having volatility and has a property of being solidified or cured by volatilization of at least a portion of the solvent to forma particle holding layer on the upper surface of the substrate;
• a first heat medium supplying unit which supplies a first heat medium, which heats the substrate, to a lower surface of the substrate;
• a peeling liquid supplying unit which supplies a peeling liquid, which peels the particle holding layer from the upper surface of the substrate, to the upper surface of the substrate;
• a second processing liquid supplying unit which supplies a second processing liquid, containing a sublimable substance, to the upper surface of the substrate;
• a second heat medium supplying unit which supplies a second heat medium, which cools the substrate, to the lower surface of the substrate;
• a sublimating unit which sublimates a solid film formed from the second processing liquid;
• a first heat medium feeding piping which feeds the first heat medium to the first heat medium supplying unit from a first heat medium supply source;
• a second heat medium feeding piping which feeds the second heat medium to the second heat medium supplying unit from a second heat medium supply source;
• a first heat medium valve which is interposed in the first heat medium feeding piping;
• and
• a second heat medium valve which is interposed in the second heat medium feeding piping,
• wherein the first heat medium supplying unit and the second heat medium supplying unit are configured to switch a heat medium supplied to the lower surface of the substrate between the first heat medium and the second heat medium when the first heat medium valve and the second heat medium valve are operated.