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US 2021/0282265 A1Published application
Printed circuit board and display module comprising the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorMyeong Hui Jung
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including a first insulating layer; and a plurality of connection pads disposed on one surface of the first insulating layer, wherein the first insulating layer has a groove portion penetrating a portion of the first insulating layer in respective regions between the plurality of connection pads, and a display module including the same.
Claims19
A printed circuit board, comprising:
- a first insulating layer comprising:
- a connection pad disposed on one surface of the first insulating layer, and
- groove portions penetrating a portion of the first insulating layer.
A display module, comprising:
- a printed circuit board having a flexible region and including an insulating layer comprising:
- a first connection pad disposed on one surface of the insulating layer, and
- groove portions penetrating a portion of the insulating layer in the flexible region of the printed circuit board;
- a display panel including a second connection pad disposed on the flexible region of the printed circuit board;
- and
- a bonding layer disposed between the flexible region of the printed circuit board and the display panel, and connecting the first connection pad and the second connection pad.
3 more elements
Dependencies are inferred from the claim text.