Proximity detection sensor arrangements, devices, and methods

Abstract

Disclosed herein are proximity detection sensor arrangements, as well as related methods and devices. In some embodiments, a sensor arrangement in an electronic device may include a first circuit layer including a proximity pad and a first reference pad, and a second circuit layer including a second reference pad and a temperature pad. The first circuit layer may be between the second circuit layer and a user-facing surface of the electronic device, the first reference pad may be electrically coupled to the second reference pad, and the first reference pad may be between the temperature pad and the user-facing surface.

Dependencies are inferred from the claim text.