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US 2021/0281286 A1Published application
Radio frequency shielding within a semiconductor package
AssigneeIntel IP Corporation
InventorsEdmund Goetz, Bernd Mwmmler, Jan-Erik Mueller, Peter Baumgartner
Life of this patent
Estimating the term…
Abstract
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
Claims16
A portable wireless device comprising:
- a touchscreen;
- a controller capable of controlling the touchscreen;
- an antenna;
- a multiple chip package having a digital chip coupled to the controller, a radio frequency chip coupled to the antenna, an isolation structure between the digital chip and the radio frequency chip, a cover enclosing the digital chip and the radio frequency chip, and
- a substrate that couples to the digital chip and the radio frequency chip, and that is electrically connected to the isolation structure and the cover.
2 more elements
A portable wireless device comprising:
- a touchscreen;
- a controller capable of controlling the touchscreen;
- an antenna;
- a multiple chip package having a digital chip coupled to the controller, a radio frequency chip coupled to the antenna, an isolation structure between the digital chip and the radio frequency chip, a cover enclosing the digital chip and the radio frequency chip, and
- one or more substrates that couple to the digital chip and the radio frequency chip, and that are electrically connected to the isolation structure and the cover.
2 more elements
A portable wireless device comprising:
- a touchscreen;
- a controller capable of controlling the touchscreen;
- an antenna;
- a multiple chip package having a digital chip coupled to the controller, a radio frequency chip coupled to the antenna, an isolation structure between the digital chip and the radio frequency chip, a cover enclosing the digital chip and the radio frequency chip, and
- a carrier that couples to the digital chip and the radio frequency chip, and that is electrically connected to the isolation structure and the cover.
2 more elements
Dependencies are inferred from the claim text.