Hybrid three dimensional inductor

Abstract

An improved filter for high frequency, such as 5G wireless communication, may include inductor-Q improvement and reduced die-size with a hybrid 3D-inductor integration. In some examples, the inductors may be formed using an IPD and a fan-out package. For instance, a first multilayer substrate comprises a plurality of metal insulator metal (MIM) capacitors formed using various layers (e.g., M1 and M2) and a first portion of the 3D inductors, and a second multilayer substrate comprises at least a second portion of the 3D inductors. The 3D inductors may be electrically coupled to the MIM capacitors to form at least one filter network.

Dependencies are inferred from the claim text.