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US 2021/0281040 A1Published application
Laser diode packaging module, distance detection device, and electronic device
AssigneeSz Dji Technology Co., Ltd.
InventorsXiang LIU, Xiaoping HONG, Shuai DONG
Life of this patent
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Abstract
The present disclosure provides a laser diode package. The package includes a sealing body, a laser diode chip placed in the sealing body, and a shaping element disposed on an outer surface of the sealing body and configured to shape light emitted from the laser diode chip.
Claims20
A laser diode package, comprising:
- a sealing body;
- a laser diode chip embedded in the sealing body;
- and
- a shaping element disposed on an outer surface of the sealing body and configured to shape light emitted from the laser diode chip.
1 more element
A distance detection device comprising:
- a distance detection module including a laser diode package configured to emit a laser pulse sequence, the laser diode package including:
- a sealing body;
- a laser diode chip placed in the sealing body;
- a shaping element disposed on an outer surface of the sealing body and configured to shape light emitted from the laser diode chip;
- and
- a detector configured to receive at least part of the laser pulse sequence reflected by an object, and obtain a distance between the distance detection device and the object based on a received light beam.
3 more elements
Dependencies are inferred from the claim text.