Backplane connector and system

A backplane connector, comprising

• a shroud;
• an insert positioned in the shroud, the insert having a conductive element;
• a plurality of wafers supported by the shroud and engaging the insert, each wafer of the plurality of wafers including an insulative frame that supports a first terminal pair and a second terminal pair, the first and second terminal pairs each having a first signal terminal and a second signal terminal that form a differential pair, each of the first and second signal terminals having a contact, a tail and a body extending therebetween, the bodies of the first and second signal terminals being edge-coupled so as to provide the differentially coupled terminal pairs and each wafer including a ground shield that provides a U-channel that extends along the bodies of the signal terminals, wherein the ground shields engage the insert;
• and
• a plurality of U-shields positioned in the insert, each of the U-shields of the plurality of U-shields arranged to partially shield the contacts of one of the terminal pairs, the U-shield electrically connected to the U-channel associated with the corresponding terminal pair via the insert, wherein each of the ground shields includes a plurality of connection frames, the connection frames electrically connecting adjacent U-channels, wherein each of the U-shields of the plurality of U-shields is configured to mate with a mating shield having a middle portion and two side portions on either side of the middle portion, the mating shield being arranged to partially shield contacts of a mating terminal pair, and the side portions of the mating shield each configured to make contact with an opposite side of the U-shield during mating.

A connector system, comprising:

• a first connector, the first connector including a first shroud that supports a plurality of first wafers, each of the first wafers having a first frame that supports a plurality of first terminal pairs, each of the first terminal pairs including first contacts, and a first ground shield that provides first U-channels associated with and shielding on three sides each of the first terminal pairs, the first connector including a first secondary shield mounted to each of the first ground shields;
• a plurality of U-shields, each of the U-shields configured to shield the first contacts of one of the first terminal pairs;
• and
• a second connector mated to the first connector, the second connector including a second shroud that supports a plurality of second wafers, each of the second wafers having a second frame that supports a plurality of second terminal pairs, each of the second terminal pairs including second contacts, and a second ground shield that provides second U-channels associated with and shielding on three sides each of the second terminal pairs, wherein each of the U-shields of the plurality of U-shields mates with a mating shield having a middle portion and two side portions on either side of the middle portion, the mating shield being arranged to partially shield second contacts of a second terminal pair, and the side portions of the mating shield each configured to make contact with an opposite side of that U-shield.