Antenna module having plurality of printed circuit boards laminated therein, and electronic device comprising same

A portable communication device comprising:

• a housing including a front plate, a rear plate, and a side member;
• a display visible through the front plate;
• a first printed circuit board (PCB) including a first core layer, the first PCB including:
• a first surface facing toward the rear plate and a second surface facing toward the front plate;
• a first insulating layer, a second insulating layer and a third insulating layer deposited in continuation between the first surface and the second surface such that the first insulating layer is located over the second insulating layer, and that the third insulating layer is located under the second insulating layer;
• and
• a radio frequency integrated circuit mounted on the second surface;
• a second PCB including a second core layer, the second PCB located between the first PCB and the rear plate, and electrically connected with the first PCB via a plurality of solders, the second PCB including:
• a third surface facing toward the rear plate and a fourth surface facing toward the first surface;
• a fourth insulating layer, a fifth insulating layer and a sixth insulating layer deposited in continuation between the third surface and the fourth surface such that the fourth insulating layer is located over the fifth insulating layer, and that the sixth insulating layer is located under the fifth insulating layer;
• and
• a first antenna array including a first antenna element and a second antenna element and configured to radiate a first beam toward the rear plate using a first frequency band, the first antenna element located on the fifth insulating layer, and the second antenna element located on the sixth insulating layer;
• wherein a height of the fifth insulating layer between the first antenna element and the second antenna element is greater than a height of the first core layer included in the first PCB.

A portable communication device comprising:

• a housing including a front plate, a rear plate, and a side member;
• a display visible through the front plate;
• a first printed circuit board (PCB) including a first core layer, the first PCB including:
• a first surface facing toward the rear plate and a second surface facing toward the front plate;
• a first insulating layer, a second insulating layer and a third insulating layer deposited in continuation between the first surface and the second surface such that the first insulating layer is located over the second insulating layer, and that the third insulating layer is located under the second insulating layer;
• and
• a radio frequency integrated circuit mounted on the second surface;
• a second PCB including a second core layer, the second PCB located between the first PCB and the rear plate, and electrically connected with the first PCB via a plurality of solders, the second PCB including:
• a third surface facing toward the rear plate and a fourth surface facing toward the first surface;
• a fourth insulating layer, a fifth insulating layer and a sixth insulating layer deposited in continuation between the third surface and the fourth surface such that the fourth insulating layer is located over the fifth insulating layer, and that the sixth insulating layer is located under the fifth insulating layer;
• and
• a first antenna element and a second antenna element, the first antenna element located on the fifth insulating layer and the second antenna element located on the sixth insulating layer;
• wherein a height of the fifth insulating layer between the first antenna element and the second antenna element is greater than a height of the first core layer included in the first PCB.

A portable communication device comprising:

• a device enclosure having exterior surfaces of the portable communication device;
• a display through a front surface of the exterior surfaces;
• a first printed circuit board (PCB) to which a radio frequency integrated circuit (RFIC) is mounted, the first PCB including:
• a first core layer, and
• a first set of insulating layers having a first material characteristic, wherein the first core layer is disposed between the insulating layers of the first set;
• and
• a second PCB located between the first PCB and a rear surface of the exterior surfaces, and electrically connected with the first PCB via a plurality of solders, the second PCB including:
• a second core layer thicker than the first core layer,
• a second set of insulating layers having a second material characteristic different from the first material characteristic, wherein the second core layer is disposed between the insulating layers of the second set, and
• a first antenna array configured to radiate signals toward the rear surface,
• wherein the second material characteristic has a smaller dielectric constant than the first material characteristic.