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US 2021/0280765 A1Published application
Superconducting carrier and cables for quantum device chips and method of fabrication
AssigneeThe Board of Trustees of The University of Alabama
InventorQiang Huang
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Abstract
A carrier is provided for quantum computer chips that allows easy implementation, connection, and communication to and from the quantum computer chips while minimizing the thermal perturbation and avoiding labor intensive manual connection as well as the human error in such manual connection. Methods for fabricating such carriers are also provided.
Claims20
A method of fabricating a carrier for quantum computer chips, the method comprising:
- forming at least one or more of holes, vias, voids, trenches, lines, or notches in an insulating substrate;
- depositing a superconducting layer on the insulating substrate in at least one of the holes, vias, voids, trenches, lines, or notches;
- and
- encapsulating the superconducting layer with an insulator.
1 more element
A deposition method comprising:
- depositing a superconducting layer on at least a portion of a seed layer, using at least one electrodeposition technique, wherein the at least one electrodeposition technique deposits at least one of vanadium, tin, indium, gallium, lead, rhenium, and the alloys of thereof, and rhenium alloys with other elements comprising at least one of molybdenum, iron, cobalt, or nickel.
Dependencies are inferred from the claim text.