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US 2021/0280761 A1Published application
Semiconductor module, temperature control system including the same, and temperature control method
AssigneeSK hynix Inc.
InventorsGyung Jin KIM, Jeong Hun LEE
Life of this patent
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Abstract
A semiconductor module includes a substrate, a semiconductor package disposed over the substrate, a Peltier element disposed over the semiconductor package and having a heat absorbing portion and a heat generating portion, the heat absorbing portion being adjacent to the semiconductor package and the heat generating portion being adjacent to a cooling element, and the cooling element disposed over the Peltier element.
Claims19
A semiconductor module comprising:
- a semiconductor package disposed over a substrate;
- a Peltier element disposed over the semiconductor package and having a heat absorbing portion and a heat generating portion, the heat absorbing portion being adjacent to the semiconductor package and the heat generating portion being adjacent to a cooling element;
- and
- the cooling element disposed over the Peltier element.
1 more element
A semiconductor module comprising:
- a substrate including a power circuit;
- a semiconductor package disposed on a first substrate;
- a Peltier element having a heat absorbing portion and a heat generation portion;
- a cooling element;
- and
- a second substrate physically separated from the first substrate and electrically connected with the first substrate for electrically connecting the semiconductor module to an external component,
- wherein the heat absorbing portion is in contact with the semiconductor package, and the heat generating portion is in contact with the cooling element, and a target cooling temperature of the semiconductor package is controlled according to a flow rate of a cooling liquid flowing through the cooling element or a power supplied to the Peltier element from the power circuit.
4 more elements
Dependencies are inferred from the claim text.