Back to results
US 2021/0280759 A1Published application
Thermoelectric material
AssigneesMitsuba Corporation, National Institute for Materials Science
InventorsSatoki Tada, Yukihiro Isoda
Life of this patent
Estimating the term…
Abstract
The present invention provides a thermoelectric material excellent in heat resistance with less degradation of thermoelectric characteristics even in a high temperature environment. The thermoelectric material comprises a compound represented by a chemical formula Mg2Si1−xSnx(0<x<1) wherein at least one of the Si site and the Sn site of the compound is replaced with at least one of Sb and Bi, and an added Fe.
Claims7
A thermoelectric material, which comprises:
- a compound represented by a chemical formula Mg2Si1−xSnx(0<x<1) wherein at least one of the Si site and the Sn site of the compound is replaced with at least one of Sb and Bi, and
- an added Fe.
Dependencies are inferred from the claim text.