Radiation-Emitting Semiconductor Chip, Method for Producing a Plurality of Radiation-Emitting Semiconductor Chips, Radiation-Emitting Component and Method for Producing a Radiation-Emitting

A radiation-emitting semiconductor chip comprising:

• a semiconductor layer sequence having an active layer configured to generate electromagnetic radiation;
• a substrate on which the semiconductor layer sequence is arranged and which is transparent to the electromagnetic radiation;
• a reflective layer disposed on a main surface of the substrate facing away from the semiconductor layer sequence, the reflective layer comprising a resin in which reflective particles are embedded;
• and
• a transparent resin layer located between the main surface of the substrate and the reflective layer.

A method for producing a plurality of radiation-emitting semiconductor chips, the method comprising:

• providing a substrate wafer having disposed thereon a semiconductor layer sequence having an active layer configured to generate electromagnetic radiation, wherein the substrate wafer is transparent to the electromagnetic radiation;
• introducing fracture nucleations in the substrate wafer along separation lines;
• applying a reflective layer to a main surface of the substrate wafer over its entire area;
• and
• mechanically breaking the substrate wafer along the separation lines to form a plurality of radiation-emitting semiconductor chips,
• wherein a transparent resin layer is disposed between the main surface of the substrate and the reflective layer.

A radiation-emitting semiconductor chip comprising:

• a semiconductor layer sequence having an active layer configured to generating electromagnetic radiation;
• a substrate on which the semiconductor layer sequence is arranged and which is transparent to the electromagnetic radiation generated in the active layer;
• a reflective layer disposed on a main surface of the substrate facing away from the semiconductor layer sequence, the reflective layer being formed of a resin in which reflective particles are embedded;
• and
• a transparent resin layer located between the main surface of the substrate and the reflective layer,
• wherein the reflective layer is freely accessible from the outside, and
• wherein the reflective layer has a thickness between 5 micrometer and 15 micrometer, inclusive.