Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsin-Ying HO, Hsun-Wei CHAN, Shih-Chieh TANG, Lu-Ming LAI
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AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsin-Ying HO, Hsun-Wei CHAN, Shih-Chieh TANG, Lu-Ming LAI
Estimating the term…
A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.
A semiconductor device package, comprising:
A semiconductor device package, comprising:
A semiconductor device package, comprising:
Dependencies are inferred from the claim text.