Optoelectronic Lighting Device, Optoelectronic Illumination Device and Method of Manufacturing

An optoelectronic lighting device comprising:

• a carrier;
• exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier;
• at least one functional layer arranged above the light emission area and/or adjacent to the light emission area;
• and
• an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and
• wherein the edging is formed of a transparent material.

An optoelectronic illumination device comprising:

• a carrier with a plurality of light points arranged in a matrix-like manner on an upper side of the carrier, each light point comprising precisely one light-emitting semiconductor component which has a light emission area on at least one surface side;
• a functional layer arranged above and/or adjacent to the light emission area of the plurality of light points;
• a plurality of edgings for the functional layer, each edging comprising a surrounding border extending along a circumferential direction and in the center of which a continuous opening is provided;
• and
• optionally at least one cover layer above the functional layer and the edgings,
• wherein the edgings are arranged at least in a plane of the functional layer such that the center of a respective edging is located at least approximately above a respective light point,
• wherein the border surrounds a region of the functional layer above and/or adjacent to the respective light point, and
• wherein the region of the functional layer at least partially fills the opening of the respective edging.

A method for manufacturing at least one optoelectronic lighting device, the method comprising:

• proving a carrier with a plurality of light points arranged in a matrix-like manner on an upper side of the carrier, each light point comprising at least one light-emitting semiconductor component;
• providing a functional layer and a plurality of edgings in a layer plane above and/or adjacent to light emission areas of the plurality of light points;
• and
• optionally providing at least one cover layer above the functional layer and the edgings,
• wherein each edging of the plurality of edgings comprises a surrounding border extending along a circumferential direction, in the center of which a continuous opening is provided,
• wherein the edgings are arranged such that the center of the border of a respective edging is located at least approximately above a respective light point, and
• wherein the edgings divide the functional layer into individual regions above and/or adjacent to the light points.