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US 2021/0280744 A1Published application
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTang-Yuan CHEN, Meng-Wei HSIEH, Cheng-Yuan KUNG
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Abstract
A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
Claims20
A semiconductor device package, comprising:
- a carrier having a first surface and a second surface opposite to the first surface;
- an emitting element disposed on the first surface of the carrier;
- and
- a first package body disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
1 more element
A semiconductor device package, comprising:
- a carrier having a first surface and a second surface opposite to the first surface;
- an emitting element disposed on the first surface of the carrier;
- a first building-up layer disposed on the second surface of the carrier, the first building-up layer having a first conductive layer, a dielectric layer covering the conductive layer and a second conductive layer on the dielectric layer and electrically connected to the first conductive layer;
- and
- an electrical element disposed on the second conductive layer.
2 more elements
A method of manufacturing a semiconductor device package, the method comprising:
- (a) providing a circuit layer including a first carrier, a first building-up layer on the first carrier and a second carrier on the first building-up layer;
- and
- (b) thinning the first carrier and the second carrier.
Dependencies are inferred from the claim text.