Method of manufacturing light emitting device and method of inspecting light emitting device

A method of inspecting a light emitting device, the method comprising:

• providing a first intermediate body including
• a substrate,
• a plurality of first bonding members,
• a second bonding member,
• a light emitting element mounted on an upper surface of the substrate via the plurality of first bonding members,
• a protecting element mounted on the upper surface of the substrate via the second bonding member and spaced apart from the light emitting element,
• a light transmissive member bonded to an upper surface of the light emitting element, and
• a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view;
• disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element exposed from the light-shielding frame in the top view such that the first resin moves toward the light emitting element along the protecting element;
• defining an inspection region on the substrate in the region outside of the portion of the protecting element exposed from the light-shielding frame in the top view;
• and
• after the disposing of the first resin, inspecting whether the first resin is disposed between the light emitting device and the substrate by detecting a shape of the first resin covering the inspection region.