Semiconductor device and imaging apparatus

An imaging apparatus, comprising:

• a first package that includes:
• a first substrate;
• a first semiconductor chip configured to output a signal corresponding to irradiating light, wherein
• the first semiconductor chip is below the first substrate;
• a first wiring electrically connected to the first semiconductor chip through a metal bump, wherein the first wiring is below the first substrate;
• and
• a first protective film that includes a first opening portion;
• a second package that includes:
• a second substrate;
• a second semiconductor chip configured to process the signal output from the first semiconductor chip, wherein the second semiconductor chip is above the second substrate;
• a second wiring electrically connected to the second semiconductor chip, wherein the second wiring is on each of a front surface of the second substrate and a back surface of the second substrate;
• an encapsulant configured to seal the second semiconductor chip and a conductive member in an opening in the encapsulant, wherein the first semiconductor chip faces the encapsulant in a non-contact manner and a gap is defined between the first semiconductor chip and the encapsulant at least to be 0.05 mm;
• and
• a second protective film that includes a second opening portion, wherein the second protective film is on each of the front surface of the second substrate and the back surface of the second substrate;
• a first connection portion configured to electrically connect the first wiring and the second wiring;
• and
• a second connection portion electrically connected to the second wiring, wherein
• the first protective film is in contact with each of the first connection portion, the first wiring, and the first substrate,
• the first connection portion is in contact with the first wiring via the first opening portion, and
• the second connection portion is in contact with the second wiring via the second opening portion.