Method of fabricating semiconductor device
AssigneeUnited Microelectronics Corp.
InventorsKuang-Hsiu Chen, Sung-Yuan Tsai, Chi-Hsuan Tang, Chun-Wei Yu, Yu-Ren Wang
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AssigneeUnited Microelectronics Corp.
InventorsKuang-Hsiu Chen, Sung-Yuan Tsai, Chi-Hsuan Tang, Chun-Wei Yu, Yu-Ren Wang
Estimating the term…
A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure and an epitaxial structure. The gate structure is disposed on the substrate, and the epitaxial structure is disposed in the substrate, at one side of the gate structure. The epitaxial structure includes a portion being protruded from a top surface of the substrate, and the portion includes a discontinuous sidewall, with a distance between a turning point of the discontinuous sidewalls and the gate structure being a greatest distance between the epitaxial structure and the gate structure.
A method of forming a semiconductor device, comprising:
Dependencies are inferred from the claim text.