Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorKenichi Matsushita
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorKenichi Matsushita
Estimating the term…
According to one embodiment, a semiconductor device includes first, second, and third electrodes, first and fourth semiconductor regions of a first conductivity type, and second and third semiconductor regions of a second conductivity type. The third semiconductor region is provided around the second semiconductor region along a first plane crossing a first direction from the first electrode toward the first semiconductor region and is separated from the second semiconductor region. The fourth semiconductor region is provided around the third semiconductor region along the first plane, and has a greater impurity concentration of the first conductivity type than the first semiconductor region. The second electrode is provided on the second semiconductor region and is electrically connected to the second semiconductor region. The third electrode is provided on the third and fourth semiconductor regions, is electrically connected to the third and fourth semiconductor regions, and is separated from the second electrode.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.