Manufacturing method of package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Shiang Liao, Chih-Hang Tung
Life of this patent
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Abstract
A manufacturing method of a package includes at least the following steps. A carrier is provided. An inductor is formed over the carrier. The inductor includes a first portion, a second portion, and a third portion. The first portion is parallel to the third portion, and the second portion connects the first portion and the third portion. A die is placed over the carrier. The die is surrounded by the inductor. An encapsulant is formed between the first portion and the third portion of the inductor. The encapsulant laterally encapsulates the die and the second portion of the inductor.
Claims20
A manufacturing method of a package, comprising:
- providing a carrier;
- forming an inductor over the carrier, wherein the inductor comprises a first portion, a second portion, and a third portion, the first portion is parallel to the third portion, and the second portion connects the first portion and the third portion;
- placing a die over the carrier, wherein the die is surrounded by the inductor;
- forming an encapsulant between the first portion and the third portion of the inductor, wherein the encapsulant laterally encapsulates the die and the second portion of the inductor.
A manufacturing method of a package, comprising:
- providing a carrier;
- placing a die over the carrier;
- forming an encapsulant over the carrier to laterally encapsulate the die;
- and
- forming an inductor over the carrier to surround the die, wherein the inductor comprises a first portion, a second portion, and a third portion, the first portion and the third portion are formed on opposite sides of the encapsulant, and the second portion is formed to penetrate through the encapsulant to connect the first portion and the third portion.
A manufacturing method of a package, comprising:
- forming a first redistribution structure, wherein the first redistribution structure comprises a first portion of an inductor;
- forming a plurality of through insulating vias (TIV) on the first redistribution structure, wherein the plurality of TIVs comprises a second portion of the inductor;
- placing a die on the first redistribution structure;
- laterally encapsulating the die and the plurality of TIVs by an encapsulant;
- and
- forming a second redistribution structure on the plurality of TIVs, the die, and the encapsulant, wherein the second redistribution structure comprises a third portion of the inductor.
Dependencies are inferred from the claim text.