Non-volatile memory (nvm) cell structure to increase reliability
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
Estimating the term…
Various embodiments of the present disclosure are directed towards an integrated chip including a first well region, second well region, and third well region disposed within a substrate. The second well region is laterally between the first and third well regions. An isolation structure is disposed within the substrate and laterally surrounds the first, second, and third well regions. A floating gate overlies the substrate and laterally extends from the first well region to the third well region. A dielectric structure is disposed under the floating gate. A bit line write region is disposed within the second well region and comprises source/drain regions disposed on opposite sides of the floating gate. A bit line read region is disposed within the second well region, is laterally offset from the bit line write region by a non-zero distance, and comprises source/drain regions disposed on the opposite sides of the floating gate.
An integrated chip comprising:
An integrated chip comprising:
A method for forming a memory device, the method comprising:
Dependencies are inferred from the claim text.