Non-volatile memory (nvm) cell structure to increase reliability
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Hsien Chen, Chun-Yao Ko, Felix Ying-Kit Tsui
Estimating the term…
Various embodiments of the present disclosure are directed towards a memory cell including first and second storage transistors. A first capacitor includes a first capacitor active region disposed within a substrate and a capacitor plate comprised of a first floating gate portion of a floating gate. A second capacitor includes a second capacitor active region disposed within the substrate and a capacitor plate comprised of a second floating gate portion of the floating gate. The first storage transistor includes source/drain regions disposed within a bit line write region and a first gate electrode comprised of a third floating gate portion of the floating gate. The second storage transistor includes source/drain regions disposed within a bit line read region and a second gate electrode comprised of a fourth floating gate portion of the floating gate. The bit line read and write regions are offset from one another by a non-zero distance.
A memory cell comprising:
An integrated circuit comprising:
A method for forming a memory device, the method comprising:
Dependencies are inferred from the claim text.