Integrated circuit bridge for photonics and electrical chip integration

A method of fabricating optoelectronic assemblies, comprising:

• positioning a Photonic Integrated Circuit (PIC) and an interposer on a carrier, wherein the PIC has a first face and a second face perpendicular to the first face, and the interposer has a third face coplanar with the first face;
• encapsulating the PIC and the interposer using a mold compound to form a reconstituted wafer including the PIC and the interposer, the reconstituted wafer having a first side coplanar with the first face and the third face and having a second side opposite to the first side, wherein the mold compound does not cover the first face and the second face;
• removing a portion of the mold compound from the second side to reveal a portion of the interposer opposite to the third face and the second face;
• and
• bonding an Electrical Integrated Circuit (EIC) with the first face and the third face to electrically bridge the PIC and the interposer.

A method, comprising:

• positioning a Photonic Integrated Circuit (PIC) on a carrier, wherein the PIC includes:
• a first face;
• a second face opposite to the first face;
• and
• a third face perpendicular to the first face;
• positioning an interposer on the carrier, wherein the interposer includes:
• a fourth face coplanar with the first face;
• and
• a fifth face coplanar with the second face;
• encapsulating the PIC and the interposer using a mold compound to form a reconstituted wafer including the PIC and the interposer, wherein the reconstituted wafer has a first side coplanar with the first face and the fourth face and a second side coplanar with the second face and the fifth face, wherein the mold compound does not cover the first face and the fourth face and the mold compound does cover the second face, the third face, and the fourth face;
• removing a portion of the mold compound from the second face, the third face, and the fourth face;
• and
• bonding an Electrical Integrated Circuit (EIC) with the first face and the fourth face to electrically bridge the PIC and the interposer.