Dual-sided co-packaged optics for high bandwidth networking applications

An electronic package, comprising:

• a first package substrate with a first surface and a second surface opposite from the first surface;
• a second package substrate attached to the second surface of first package substrate;
• a die attached to the second package substrate;
• first photonic engines attached to the first surface of the package substrate, wherein the first photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate;
• second photonic engines attached to the second surface of the package substrate, wherein the second photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate;
• a first socket attached to the first surface of the package substrate, wherein the first socket is within a footprint of the die;
• and
• a plurality of second sockets attached to the first surface of the package substrate, wherein individual ones of the second sockets are outside of the footprints of individual ones of the first photonic engines and the second photonic engines.

An electronic system, comprising:

• a board;
• a first package substrate attached to the board by a first socket and a plurality of second sockets, the first package substrate having a first surface facing the board and a second surface facing away from the board;
• first photonic engines attached to the first surface of the package substrate by third sockets;
• second photonic engines attached to the second surface of the package substrate by third sockets;
• a cooling component over the first photonic engines and over the second photonic engines, the cooling component secured against the first photonic engines and the second photonic engines by a first retention frame and a second retention frame;
• a second package substrate attached to the second surface of the first package substrate;
• and
• a die attached to the second package substrate, wherein the die is communicatively coupled to individual ones of the first photonic engines and individual ones of the second photonic engines through the first package substrate and the second package substrate.