Semiconductor device package and method for manufacturing the same

A semiconductor device package, comprising:

• a first conductive structure comprising:
• a substrate;
• at least one first electronic component embedded in the substrate;
• and
• a first circuit layer disposed on the substrate and electrically connected to the first electronic component, wherein the first circuit layer comprises a conductive wiring structure;
• and
• a second conductive structure disposed on the first conductive structure, wherein the second conductive structure comprises a second circuit layer, the conductive wiring structure includes a non-soldering joint between the first circuit layer and the second circuit layer, and the non-soldering joint electrically connects the first circuit layer to the second circuit layer.

A semiconductor device package, comprising:

• a first conductive structure comprising:
• a substrate;
• at least one first electronic component disposed in the substrate;
• and
• a circuit layer disposed on the substrate, and electrically connected to the first electronic component;
• and
• a second conductive structure disposed on the first conductive structure, and electrically connected to the first conductive structure, wherein a line width of the second conductive structure is less than a line width of the first conductive structure, or a line space of the second conductive structure is less than a line space of the first conductive structure.