Semiconductor devices having a conductive pillar and methods of manufacturing the same

A semiconductor package comprising:

• a first redistribution structure;
• a first semiconductor chip disposed on the first redistribution structure;
• a conductive pillar disposed on the first redistribution structure;
• a first encapsulant covering an upper surface of the first redistribution structure, the conductive pillar, and side surfaces of the first semiconductor chip;
• a second redistribution structure disposed on the first encapsulant and connected to the conductive pillar, the second redistribution structure including a connection via in contact with the conductive pillar;
• a second semiconductor chip disposed on the second redistribution structure;
• and
• a second encapsulant covering the second redistribution structure and the second semiconductor chip,
• wherein an upper surface of the connection via has a width greater than a width of a lower surface of the connection via,
• wherein a side surface of the conductive pillar and at least a portion of the connection via are surrounded by the first encapsulant, and
• wherein a ratio of a distance from a lower surface of the conductive pillar to the lower surface of the connection via to a distance from the lower surface of the conductive pillar to an upper surface of the first encapsulant is 0.8 or less.