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US 2021/0280558 A1Published application
Integrated circuit package with glass spacer
AssigneeIntel Corporation
InventorsMao Guo, Hyoung Il Kim, Yong She, Sireesha Gogineni
Life of this patent
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Abstract
Apparatuses, systems and methods associated with integrated circuit (IC) package design are disclosed herein. In embodiments, an IC package may include a first die and a second die. The IC package may include a spacer located between the first die and the second die, the spacer includes glass , and a molding compound that at least partially encompasses the first die, the second die, and the spacer. Other embodiments may be described and/or claimed.
Claims21
1-25. (canceled)
An integrated circuit (IC) package, comprising:
- a first die;
- a second die;
- a spacer located between the first die and the second die, the spacer includes glass;
- and
- a molding compound that at least partially encompasses the first die, the second die, and the spacer.
2 more elements
A computer system, comprising:
- a printed circuit board (PCB);
- and
- a system-in-package (SIP) mounted, on a first side of the SIP, to the PCB, wherein the SIP includes:
- dynamic random-access memory (DRAM);
- an application-specific integrated circuit (ASIC), the ASIC located between the DRAM and the first side of the SIP;
- and
- a spacer that includes glass, the spacer located between the DRAM and the ASIC.
4 more elements
Dependencies are inferred from the claim text.