Apparatuses and methods for coupling a plurality of semiconductor devices

A multi-die device, comprising:

• a substrate including a conductive signal line;
• a stack of semiconductor devices attached to the substrate, each of the semiconductor devices of the stack including a terminal and a redistribution layer structure coupled to the terminal, and wherein the terminals of the semiconductor devices of the stack are coupled together in a daisy chain manner through the redistribution layer structures;
• and
• a circuit attached to the substrate and coupled to a first semiconductor device of the stack of semiconductor devices by the conductive signal line.

An apparatus, comprising:

• a memory army configured to store data;
• a terminal;
• an input/output circuit configured to receive data from the memory array and provide read data and receive write data to be stored in the memory array;
• a command and address input circuit configured to receive command and address signals;
• first and second bond pads;
• and
• a U-shaped conductive structure coupled to the terminal and including a first portion extending between and coupled to the terminal and the first bond pad and further including a second portion extending between and coupled to the terminal and the second bond pad.

A method, comprising:

• coupling a bond bad of a first semiconductor device to a first U-shaped conductive structure;
• coupling a bond bad of a second semiconductor device to a second U-shaped conductive structure;
• coupling a bond bad of a third semiconductor device to a third U-shaped conductive structure;
• coupling a second portion of the first U-shaped conductive structure to a first portion of the second U-shaped conductive structure;
• and
• coupling a second portion of the second U-shaped conductive structure to a first portion of the third U-shaped conductive structure,
• wherein a first portion of the first U-shaped conductive structure is coupled to a circuit and wherein a second portion of the third U-shaped conductive structure is coupled to a fourth semiconductor device.