Semiconductor module

A semiconductor module, comprising:

• an insulating substrate having an upper surface, and having a main wiring layer though which a main current of the semiconductor module flows, the main wiring layer being formed on the upper surface of the insulating substrate;
• a first external terminal and a second external terminal adjacently arranged along a line extending in a first direction;
• a plurality of semiconductor elements forming a first column and a plurality of semiconductor elements forming a second column, the first and second columns each extending in the first direction, the plurality of semiconductor elements in the first column being electrically connected in parallel to the other plurality of semiconductor elements in the second column, each semiconductor element in the first and second columns having an upper surface, and having a gate electrode and a source electrode on the upper surface thereof, and being disposed on the main wiring layer such that the gate electrodes of the semiconductor elements in the first column and the gate electrodes of the semiconductor elements in the second column face each other in a second direction orthogonal to the first direction;
• a control wiring substrate through which a control current for controlling the semiconductor elements flows, the control wiring substrate being disposed between the first column and the second column and having a gate wiring layer and a source wiring layer each extending in the first direction;
• a gate wiring member connecting one of the gate electrodes in the first column and one of the gate electrodes in the second column through the gate wiring layer;
• and
• a source wiring member connecting one of the source electrodes in the first column and one of the source electrode in the second column through the source wiring layer.