Semiconductor package structure with heat sink and method preparing the same

A method for making a chip package structure having a heat sink, comprising:

• providing a package substrate and a chip;
• bonding the chip to a top surface of the package substrate;
• forming a heat-conducting lead on the chip, wherein the heat-conducting lead comprises an arc-shaped vertical wire having a first end and a second end opposite to the first end, wherein the first end is connected with a surface of the chip through a wire bonding bump and the second end is connected with a solder ball;
• disposing a plastic package material layer that packages the chip and the heat-conducting lead, wherein a surface of the plastic package material layer exposes the solder ball on the second end of the heat-conducting lead;
• forming a heat-conducting adhesive layer on the surface of the plastic package material layer, wherein the heat-conducting adhesive layer is in contact with the solder ball on the second end of the heat-conducting lead;
• and
• forming a heat dissipation layer on a surface of the heat-conducting adhesive layer.