Semiconductor module

A semiconductor module, comprising:

• a first semiconductor element, a second semiconductor element, a third semiconductor element, and a fourth semiconductor element, each having an upper surface and a lower surface opposite to each other, and having an upper-surface electrode on the upper surface thereof and a lower-surface electrode on the lower surface thereof;
• a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer, each extending in a first direction and independently disposed side by side in a second direction orthogonal to the first direction;
• and
• a case terminal disposed at a first side of the semiconductor module, and being connected to the second conductive layer and the third conductive layer, wherein
• the lower-surface electrode of the first semiconductor element is conductively connected to the first conductive layer,
• the lower-surface electrode of the second semiconductor element is conductively connected to the second conductive layer,
• the lower-surface electrode of the third semiconductor element is conductively connected to the third conductive layer,
• the lower-surface electrode of the fourth semiconductor element is conductively connected to the fourth conductive layer, and
• the third conductive layer and the fourth conductive layer are disposed between the first conductive layer and the second conductive layer and are connected to the case terminal to have an equal potential.