Semiconductor module

A semiconductor module, comprising:

• a first semiconductor element and a second semiconductor element each having an upper surface and a lower surface opposite to each other, and having an upper-surface electrode on the upper surface thereof and a lower-surface electrode on the lower surface thereof, the first and second semiconductor elements being electrically connected in parallel to each other to configure an upper arm;
• a first conductive layer having a U-shape in planar view of the semiconductor module and having two end portions, the first conductive layer having an upper surface on which the first semiconductor element and the second semiconductor element are disposed in a mirror image arrangement;
• a positive electrode terminal having a body part and at least two positive electrode ends branched from the body part, one of the positive electrode ends being connected to one of the two end portions of the first conductive layer and an other of the positive electrode ends being connected to the other of said two end portions;
• and
• a negative electrode terminal having a negative electrode end disposed between the one and said other of the positive electrode ends.