Semiconductor structure and method for manufacturing the same

A semiconductor structure comprising:

• a first substrate;
• a plurality of first bonding pads disposed over the first substrate;
• and
• a plurality of second bonding pads disposed over the first substrate,
• wherein the first bonding pads are separated from each other in a first distance, and the second bonding pad is separated from its adjacent first bonding pad in a second distance, and the second distance is greater than the first distance.

A method for forming a semiconductor structure, comprising:

• providing a first substrate comprising a plurality of first bonding pads and a plurality of second bonding pads;
• providing a second substrate comprising a plurality of third bonding pads;
• and
• bonding the first bonding pads and the second bonding pads to the third bonding pads,
• wherein one of the first bonding pads is separated from one of the second bonding pads by a first distance before the bonding, and the first distance is increased to a second distance after the bonding.