Semiconductor device and semiconductor device manufacturing method

A semiconductor device manufacturing method comprising:

• forming, on a main face of a first semiconductor chip, a plurality of redistribution lines including a redistribution line that includes a first land and a redistribution line that includes a second land, the second land having a surface area that is less than a surface area of the first land;
• forming a first electrode in a region encompassed by the first land in plan view, one end of the first electrode in a stacking direction of the first semiconductor chip and the plurality of redistribution lines being connected to the first land;
• forming a second electrode in a region encompassed by the second land in plan view, one end of the second electrode in the stacking direction being connected to the second land;
• connecting a third electrode provided on a main face of a second semiconductor chip to the second electrode to mount the second semiconductor chip on the first semiconductor chip;
• and
• forming an external connection terminal at another end of the first electrode in the stacking direction,
• wherein a shortest distance between an outer edge of the second land and an outer edge of the second electrode in plan view, is less than, a shortest distance between an outer edge of the first land and an outer edge of the first electrode in plan view.