Device comprising contact to contact coupling of packages

An apparatus comprising:

• a first package comprising:
• a first integrated device comprising a front side and a back side;
• first means for encapsulation encapsulating the first integrated device;
• a plurality of vias traveling through the first means for encapsulation;
• a first redistribution portion comprising a first plurality of interconnects,
• wherein the first redistribution portion is coupled to the first means for encapsulation;
• and
• a first plurality of contacts coupled to the first integrated device;
• and
• a second package coupled to the first package through contact to contact coupling, wherein the second package comprises:
• a passive device;
• second means for encapsulation encapsulating the passive device;
• a second redistribution portion comprising a second plurality of interconnects, wherein the second redistribution portion is coupled to the passive device and the second means for encapsulation;
• and
• a second plurality of contacts coupled to the passive device, wherein the second plurality of contacts is coupled to the first plurality of contacts from the first package.

A method for fabricating a device, comprising:

• providing a first package comprising:
• a first integrated device comprising a front side and a back side;
• a first encapsulation layer encapsulating the first integrated device;
• a plurality of vias traveling through the first encapsulation layer;
• a first redistribution portion comprising a first plurality of interconnects, wherein the first redistribution portion is coupled to the first encapsulation layer;
• and
• a first plurality of contacts coupled to the first integrated device;
• providing a second package comprising:
• a passive device;
• a second encapsulation layer encapsulating the passive device;
• a second redistribution portion comprising a second plurality of interconnects, wherein the second redistribution portion is coupled to the passive device and the second encapsulation layer;
• and
• a second plurality of contacts coupled to the passive device, wherein the second plurality of contacts is coupled to the first plurality of contacts from the first package;
• and
• coupling the first package to the second package through contact to contact coupling.