Semiconductor package including interconnection member and bonding wires and manufacturing method thereof

A method of manufacturing a semiconductor package, comprising:

• providing a package substrate;
• placing a first die on the package substrate;
• placing a second die over the first die;
• coupling the first die and the second die via an interconnection member, wherein the interconnection member comprises:
• a connection plate comprising a plurality of electrodes, wherein the plurality of electrodes are disposed on a first surface of the connection plate, and the first die physically contacts a second surface of the connection plate;
• a plurality of redistribution structures connected to the second die;
• and
• a plurality of bumps respectively coupling the plurality of electrodes to the redistribution structures;
• coupling the plurality of electrodes to the package substrate via a plurality of first bonding wires;
• and
• coupling the plurality of electrodes to the first die via a plurality of second bonding wires.