Semiconductor device
AssigneeKioxia Corporation
InventorDaisuke KIMURA
Life of this patent
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Abstract
A semiconductor device includes a substrate, a semiconductor chip, and a sealing member. The semiconductor chip is disposed on the substrate. The semiconductor chip includes a first principal surface on a side of the substrate and a second principal surface on a side opposite to the first principal surface. The sealing member seals the semiconductor chip. The sealing member includes a first sealing member and a second sealing member. The second sealing member faces at least a part of the second principal surface. A permittivity of the second sealing member is lower than a permittivity of the first sealing member.
Claims20
A semiconductor device comprising:
- a substrate;
- a semiconductor chip disposed on the substrate, the semiconductor chip including a first surface on a side facing the substrate and a second surface on a side opposite to the first surface;
- and
- a sealing member sealing the semiconductor chip, the sealing member including a first sealing member and a second sealing member, the second sealing member facing at least a part of the second surface, and a permittivity of the second sealing member being lower than a permittivity of the first sealing member.
Dependencies are inferred from the claim text.