US 2021/0280532 A1 · SEMICONDUCTOR PACKAGE

Abstract

According to one embodiment, a semiconductor package includes a semiconductor chip, a sealing resin that has a flat plate shape and seals the semiconductor chip inside, a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin, a second electrode that includes a second mounting surface exposed on the first main face, and a groove provided on the first main face. The first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode. The groove includes a first connection portion connected to the first end portion, and a second connection portion connected to a lateral face of the sealing resin.

Claims18

Dependent claims

A semiconductor package comprising:

a semiconductor chip;
a sealing resin that has a flat plate shape and seals the semiconductor chip inside;
a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin;
a second electrode that includes a second mounting surface exposed on the first main face;
and
a groove provided on the first main face,
wherein
the first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode, and
the groove includes
a first connection portion connected to the first end portion, and
a second connection portion connected to a lateral face of the sealing resin.

8 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims18